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CFRMT107-HF - Comchip Technology

Description: DIODE GEN PURP 1KV 1A SOD123H

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PCB Footprints
CFRMT107-HF - Comchip Technology PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123H
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3D Models
CFRMT107-HF - Comchip Technology  - 3D model - Small Outline Diode Flat Lead - SOD-123H
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CFRMT107-HF Details

  • Manufacturer Part Number:

    CFRMT107-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOD-123H, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    25 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.5 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CFRMT107-HF Frequently Asked Questions (FAQs)

  • Store the component in a dry, cool place, away from direct sunlight, with a temperature range of -20°C to 40°C and humidity below 60%.
  • Handle the component in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the component's pins or leads.
  • Use a soldering temperature profile with a peak temperature of 240°C to 250°C, and a dwell time of 1-2 seconds to prevent thermal damage.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress and vibration-induced failure.
  • Use a systematic approach to troubleshoot, checking for correct component orientation, soldering quality, and PCB design; use oscilloscopes or logic analyzers to diagnose signal integrity issues.

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CFRMT107-HF Overview

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