The recommended PCB footprint for the CG0402MLE-18G is a rectangular pad with dimensions of 1.3 mm x 0.8 mm, with a 0.5 mm diameter hole in the center for the chip inductor's terminal.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum current rating for the CG0402MLE-18G is 1.8 A, as specified in the datasheet. Exceeding this rating may cause the component to overheat or fail.
The CG0402MLE-18G is rated for operation up to 125°C. However, it's recommended to derate the component's current rating and consider the application's thermal management to ensure reliable operation in high-temperature environments.
Store the CG0402MLE-18G in its original packaging or a similar ESD-protective package. Avoid exposing the component to moisture, direct sunlight, or extreme temperatures during storage and shipping.
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CG0402MLE-18G Overview
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