MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
MACOM provides a reference design and application notes for input and output matching networks. Engineers can use simulation tools like ADS or AWR to optimize the matching networks for their specific application.
MACOM recommends a sequential biasing scheme, with the drain voltage applied first, followed by the gate voltage. The recommended biasing conditions are Vd = 28V, Vg = 1.2V, and Idq = 200mA.
MACOM recommends using ESD protection devices, such as TVS diodes, and overvoltage protection circuits, such as voltage regulators and zener diodes, to protect the device from ESD and overvoltage events.
MACOM recommends using a forced-air cooling system or a liquid cooling system, depending on the power density and thermal requirements of the application. A heat sink with a thermal interface material (TIM) is also recommended.
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CGHV31500F Overview
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