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CGRA4007-G - Comchip Technology

Description: COMCHIP TECHNOLOGY CGRA4007-G SMT Diode, 1000V 1A, 2-Pin DO-214AC

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CGRA4007-G - Comchip Technology - PCB symbol
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PCB Footprints
CGRA4007-G - Comchip Technology PCB footprint - Diodes Moulded - Diodes Moulded - CGRA4007-G
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3D Models
CGRA4007-G - Comchip Technology - 3D model - Diodes Moulded - CGRA4007-G
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CGRA4007-G Details

  • Manufacturer Part Number:

    CGRA4007-G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    1.8 µs

  • Surface Mount:

    YES

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CGRA4007-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation.
  • Use a shielded enclosure, keep cables away from the device, and ensure a common ground plane. Follow IEC 61000-4-2 and IEC 61000-4-4 standards for EMC compliance.
  • Use a reflow soldering profile with a peak temperature of 240°C, a dwell time of 30-60 seconds, and a ramp-up rate of 1-2°C/s.
  • Check the power supply voltage, decoupling capacitors, and PCB layout. Verify that the device is operated within the recommended temperature range and that the input signals are within the specified voltage range.
  • Use a low-pass filter with a cutoff frequency of 100 kHz to 1 MHz to remove high-frequency noise. Ensure the input signal is within the specified voltage range and has a rise time of 10 ns or slower.

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CGRA4007-G Overview

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CGRA4007-G Alternates

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Part Image FM4007-H Formosa Microsemi Co Ltd

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Part Image S1MF3G Taiwan Semiconductor

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Part Image SS1M-S Suzhou Good-Ark Electronics Co Ltd

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Part Image GS1A-L Microsemi Corporation (now Microchip)

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For a full list of alternate parts for CGRA4007-G, check out Findchips.com