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CGRM4005-G - Comchip Technology

Description: DIODE GENERAL PURPOSEOSE 600V 1A SMA COMCHIP TECHNOLOGY CGRM4005-G, SMT Diode, 600V 1A, 2-Pin SOD-123

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Symbol
CGRM4005-G - Comchip Technology - PCB symbol
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PCB Footprints
CGRM4005-G - Comchip Technology PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123-1
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3D Models
CGRM4005-G - Comchip Technology - 3D model - Small Outline Diode Flat Lead - SOD-123-1
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CGRM4005-G Details

  • Manufacturer Part Number:

    CGRM4005-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CGRM4005-G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, ensure proper PCB design, and follow the recommended operating conditions. Consider using a thermal interface material (TIM) for improved heat transfer.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 30-60 seconds. Ensure proper solder paste selection and PCB preparation.
  • Use ESD-safe materials, follow proper handling procedures, and implement ESD protection devices (e.g., wrist straps, mats, and ionizers) to prevent damage during assembly and testing.
  • Store devices in their original packaging, in a dry, cool place (20°C to 30°C, 50% to 60% RH). Avoid exposure to direct sunlight, moisture, and extreme temperatures.

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CGRM4005-G Overview

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