The recommended land pattern for CHP0805-FX-1002ELF is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
During reflow soldering, it's recommended to use a peak temperature of 260°C (500°F) for a maximum of 20-30 seconds. The component should be placed on a flat, even surface, and the solder paste should be applied evenly to ensure proper wetting.
Yes, the CHP0805-FX-1002ELF is compatible with lead-free soldering. Bourns Inc. recommends using a lead-free solder alloy with a melting point of 217°C (423°F) or higher.
The maximum operating temperature range for the CHP0805-FX-1002ELF is -40°C to 125°C (-40°F to 257°F). However, the component's performance may degrade at extreme temperatures, so it's recommended to operate within the specified temperature range for optimal performance.
To prevent moisture absorption, it's recommended to store the CHP0805-FX-1002ELF in a dry, cool place with a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed, moisture-proof bag.
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