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CHT-555-CDIL8-T - Cissoid

Description: PULSAR Series 5 V (-55°C to 225°C) 4.2 Mhz 350 uA 555 Timer - CDIL-8

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CHT-555-CDIL8-T - Cissoid PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - Ceramic DIL8
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CHT-555-CDIL8-T Details

  • Manufacturer Part Number:

    CHT-555-CDIL8-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIL-8

  • Country Of Origin:

    Belgium

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Cissoid S A

  • YTEOL:

    0

  • Analog IC - Other Type:

    WAVEFORM GENERATION

  • JESD-30 Code:

    R-CDIP-T8

  • Length:

    13.2 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Output Frequency-Max:

    4.2 MHz

  • Package Body Material:

    CERAMIC

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.62 mm

CHT-555-CDIL8-T Frequently Asked Questions (FAQs)

  • The thermal resistance of the CHT-555-CDIL8-T is not explicitly stated in the datasheet, but it can be estimated to be around 2-3°C/W, considering the package type and size.
  • To ensure reliability, follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power dissipation according to the ambient temperature.
  • The CHT-555-CDIL8-T is not specifically designed for radiation-hardened applications. If you need a radiation-tolerant device, consider using a different component or consulting with the manufacturer for custom solutions.
  • The datasheet provides general guidelines for PCB layout and thermal pad design. For optimal performance, follow the recommended layout and consider using thermal vias to improve heat dissipation.
  • Start by checking the device's operating conditions, power supply, and thermal management. Use oscilloscopes and thermal imaging tools to identify the root cause of the issue. Consult the datasheet and application notes for troubleshooting guidelines.

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CHT-555-CDIL8-T Overview

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