Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure proper thermal management, minimize parasitic inductance, and optimize performance.
To minimize electromagnetic interference (EMI), keep the inductor at least 5 mm away from sensitive components. You can also use shielding techniques, such as copper tape or mu-metal shielding, to contain the magnetic field.
While the datasheet specifies a maximum rated voltage of 100 V, it's essential to derate the voltage based on the application's operating frequency and temperature. Consult with Bourns' application engineers for specific guidance.
The SRF is typically not specified in the datasheet. To determine the SRF, use a network analyzer or impedance analyzer to measure the inductor's impedance vs. frequency. The SRF is the frequency at which the impedance peaks. Ensure your design operates below the SRF to avoid unwanted resonances.
For high-current applications, ensure good thermal contact between the inductor and the PCB. Use thermal vias, thermal pads, or even a heat sink to dissipate heat. Monitor the inductor's temperature rise and adjust the design accordingly to prevent overheating.
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