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CIG10W4R7MNC - SAMSUNG

Description: FIXED IND 4.7UH 620MA 500 MOHM

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PCB Footprints
CIG10W4R7MNC - SAMSUNG PCB footprint - Inductors Chip - Inductors Chip - 0603 (1608 Metric)
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3D Models
CIG10W4R7MNC - SAMSUNG  - 3D model - Inductors Chip - 0603 (1608 Metric)
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CIG10W4R7MNC Details

  • Manufacturer Part Number:

    CIG10W4R7MNC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    0

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.5 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Current-Max:

    0.62 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 20%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

CIG10W4R7MNC Frequently Asked Questions (FAQs)

  • The recommended land pattern can be found in the Samsung Electro-Mechanics' application note or the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and prevent defects.
  • Follow the recommended reflow soldering profile provided in the datasheet. Ensure the component is properly aligned and secured during the reflow process to prevent movement or tombstoning.
  • The maximum operating temperature range for the CIG10W4R7MNC is -55°C to 125°C. However, it's essential to note that the component's performance and reliability may degrade if operated at extreme temperatures for extended periods.
  • While the CIG10W4R7MNC is designed to be robust, it's essential to ensure proper mounting and securing of the component to prevent damage or dislodging due to vibration. Consult the datasheet and application notes for guidance on mechanical stress and vibration testing.
  • Store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the components by the edges or the recommended handling areas to prevent damage or electrostatic discharge (ESD).

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CIG10W4R7MNC Overview

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