CJS-1200TB1 footprint, schematic symbol and 3D model by Nidec Copal

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CJS-1200TB1 Details

The recommended PCB layout for optimal thermal performance involves placing the component on a thermal land with a minimum size of 10mm x 10mm, and ensuring good thermal conductivity between the component and the PCB.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid applying excessive force or vibration during the soldering process.
The maximum allowable voltage for the CJS-1200TB1 is 1.5 times the rated voltage, but not exceeding 150V. Exceeding this voltage may cause damage to the component.
Handle the CJS-1200TB1 with care to avoid mechanical stress, and store it in a dry, cool place away from direct sunlight. Avoid exposing the component to moisture, dust, or extreme temperatures.
The recommended reflow soldering profile for the CJS-1200TB1 involves a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds above 217°C.

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