The recommended land pattern for the CK45-E3DD103ZYNNA can be found in the TDK Corporation's application note or the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
The CK45-E3DD103ZYNNA is a moisture-sensitive device. It's recommended to store it in a dry environment (less than 20% RH) and to follow the MSL (Moisture Sensitivity Level) guidelines for handling and storage. Baking the component before reflow soldering may be necessary to prevent damage.
The maximum reflow temperature for the CK45-E3DD103ZYNNA is 260°C (500°F) for a maximum of 30 seconds. Exceeding this temperature or time may damage the component.
The CK45-E3DD103ZYNNA is designed to withstand moderate vibration. However, it's essential to evaluate the component's performance in your specific application and consider additional mechanical stress testing if the vibration levels exceed 10G.
The recommended soldering process for the CK45-E3DD103ZYNNA is a reflow soldering process with a peak temperature of 240°C (464°F) and a dwell time of 30-60 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component.
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CK45-E3DD103ZYNNA Overview
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About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
