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CL31B475KBHVPJE - SAMSUNG

Description: 4.7 µF ±10% 50V Ceramic Capacitor X7R 1206 (3216 Metric)

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CL31B475KBHVPJE - SAMSUNG - PCB symbol
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PCB Footprints
CL31B475KBHVPJE - SAMSUNG PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 1206 (3216 Metric)_2024-2
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3D Models
CL31B475KBHVPJE - SAMSUNG - 3D model - Capacitor Chip Non-polarised - 1206 (3216 Metric)_2024-2
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CL31B475KBHVPJE Details

  • Manufacturer Part Number:

    CL31B475KBHVPJE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    7.49

  • Capacitance:

    4.7 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    50 V

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

CL31B475KBHVPJE Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is between 250°C to 260°C for a maximum of 3 seconds.
  • Yes, the CL31B475KBHVPJE is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • The CL31B475KBHVPJE is rated for operation up to 125°C, but its capacitance and ESR may degrade at high temperatures. Consult the datasheet for temperature derating information.
  • Yes, the CL31B475KBHVPJE is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for the CL31B475KBHVPJE is a rectangular pad with a minimum size of 2.5 mm x 1.6 mm, with a non-solder mask defined (NSMD) pad shape.

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CL31B475KBHVPJE Overview

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CL31B475KBHVPJE Alternates

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Part Image C3216X7R1H475KT TDK Corporation

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 4.7uF, Surface Mount, 1206
Part Image C1206F475K5RALTM KEMET Corporation

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 4.7uF, Surface Mount, 1206
Part Image C1206F475K5RALTU KEMET Corporation

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Part Image C1206F475K5RACTM KEMET Corporation

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 4.7uF, Surface Mount, 1206
Part Image 12065C475KAZ7A Kyocera AVX Components

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 4.7uF, Surface Mount, 1206
For a full list of alternate parts for CL31B475KBHVPJE, check out Findchips.com