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CLRC66303EV - NXP

Description: VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8 mm body

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Symbol
CLRC66303EV - NXP - PCB symbol
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PCB Footprints
CLRC66303EV - NXP PCB footprint - BGA - BGA - VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8
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3D Models
CLRC66303EV - NXP - 3D model - BGA - VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for CLRC66303EV
  • Part Number CLRC66303EV
  • Manufacturer NXP
  • Pin Count 36
  • Part Category Integrated Circuit
  • Package Category BGA
  • Footprint Name BGA - VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8
  • Released Date Jan 3, 2026
  • Last Modified Date Jan 3, 2026 5:35 AM UTC
  • Pinout / Pin List Click Here (Member Only)

CLRC66303EV Details

  • Manufacturer Part Number:

    CLRC66303EV

  • Manufacturer:

    NXP Semiconductors

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CLRC66303EV Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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