CLS03(TE16L,Q) footprint, schematic symbol and 3D model by Toshiba

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PCB Footprints

CLS03(TE16L,Q) - Toshiba PCB footprint - Other - Other - CLS03(TE16L,Q)-3

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Part Number CLS03(TE16L,Q)
Manufacturer Toshiba
Pin Count 2
Part Category Schottky Diode
Package Category Other
Footprint Name Other - CLS03(TE16L,Q)-3
Released Date Jan 13, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

CLS03(TE16L,Q) Details

Manufacturer Part Number:
CLS03(TE16L,Q)
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
ECCN Code:
EAR99
Manufacturer:
Toshiba America Electronic Components
YTEOL:
0
Application:
GENERAL PURPOSE
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.58 V
JESD-30 Code:
R-PSSO-G1
Non-rep Pk Forward Current-Max:
100 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
1
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
10 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Rep Pk Reverse Voltage-Max:
60 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Form:
GULL WING
Terminal Position:
SINGLE

CLS03(TE16L,Q) Frequently Asked Questions (FAQs)

Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
Toshiba recommends using a heat sink, ensuring good airflow, and following the recommended derating curves for temperature and voltage to ensure reliable operation in high-temperature environments.
The maximum allowable power dissipation for CLS03(TE16L,Q) is 1.5W, and it's essential to follow the recommended derating curves to ensure safe operation.
Yes, CLS03(TE16L,Q) can be used in switching regulator applications, but it's essential to ensure that the device is operated within its recommended specifications and that the switching frequency is within the recommended range.
Toshiba recommends following proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging to prevent damage to the device.

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