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CLT3-4BT6 - STMicroelectronics

Description: TVS Diode CLT3-4BT6, TSSOP 20-Pin

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PCB Footprints
CLT3-4BT6 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP20 dimensions*
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3D Models
CLT3-4BT6 - STMicroelectronics  - 3D model - Small Outline Packages - TSSOP20 dimensions*
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CLT3-4BT6 Details

  • Manufacturer Part Number:

    CLT3-4BT6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Differential Output:

    NO

  • Interface IC Type:

    BUS TERMINATOR SUPPORT CIRCUIT

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Signal Lines:

    4

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

CLT3-4BT6 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Ensure proper PCB design, and consider using a thermal interface material (TIM) for improved heat transfer.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Ensure a soldering iron temperature of 350°C (662°F) for hand soldering.
  • Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the device by the body or pins, avoiding direct contact with the die. Use ESD-protective packaging and storage materials.
  • Store the device in its original packaging, away from direct sunlight, moisture, and extreme temperatures (–40°C to 125°C). Avoid bending or flexing the leads.

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CLT3-4BT6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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