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CM1213A-01SO - onsemi

Description: Obsolete - ESD Protection Array, Low Capacitance, 1, 2 and 4-Channel

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PCB Footprints
CM1213A-01SO - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
CM1213A-01SO - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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CM1213A-01SO Details

  • Manufacturer Part Number:

    CM1213A-01SO

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    9 V

  • Breakdown Voltage-Min:

    6.5 V

  • Breakdown Voltage-Nom:

    7.75 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CM1213A-01SO Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to improve heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current ratings. Also, consider the thermal derating curves provided in the datasheet to ensure the device does not exceed its maximum junction temperature.
  • The CM1213A-01SO has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the CM1213A-01SO is qualified for automotive and high-reliability applications. However, it's essential to review the device's AEC-Q100 qualification and PPAP documentation to ensure it meets the specific requirements of your application.
  • Check the input voltage, output voltage, and output current to ensure they are within the recommended operating ranges. Verify that the device is properly connected and that the PCB layout is correct. If issues persist, consult the datasheet or contact onsemi support for further assistance.

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CM1213A-01SO Overview

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