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CM1216-08MR - onsemi

Description: Six and eight channels of ESD protection; Provides ±15 kV ESD protection on each channel per the IEC 61000-4-2 ESD requirements; Channel loading capacitance of 1.6 pF typical

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CM1216-08MR - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MSOP10 3X3 CASE 846AE
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CM1216-08MR - onsemi  - 3D model - Small Outline Packages - MSOP10 3X3 CASE 846AE
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CM1216-08MR Details

  • Manufacturer Part Number:

    CM1216-08MR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP 10, 3x3

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    846AE

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clamping Voltage-Max:

    9 V

  • Configuration:

    SINGLE, 8 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CM1216-08MR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper PCB layout and handling procedures to minimize ESD risks.
  • The recommended storage temperature range is -40°C to 150°C. Storing the device outside this range can affect its reliability and performance.

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CM1216-08MR Overview

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Part Image CM1216-08MS California Micro Devices

Trans Voltage Suppressor Diode, Unidirectional, 1 Element, Silicon