A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a voltage rating of 25V or higher for input and output filtering.
Use a shielded enclosure, keep sensitive components away from the CM1693-04DE, and implement a common-mode choke or ferrite bead on the input lines.
Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before enabling the device.
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CM1693-04DE Overview
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