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CMD245C4 - Qorvo

Description: 6-18 GHz (C, X, Ku Band) Low Phase Noise Amplifier MMIC

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PCB Footprints
CMD245C4 - Qorvo PCB footprint - Other - Other - Ceramic QFN 4x4 mm x 24 leads
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3D Models
CMD245C4 - Qorvo  - 3D model - Other - Ceramic QFN 4x4 mm x 24 leads
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CMD245C4 Details

  • Manufacturer Part Number:

    CMD245C4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    7

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    14 dB

  • Input Power-Max (CW):

    17 dBm

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Frequency-Max:

    18000 MHz

  • Operating Frequency-Min:

    6000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    LOW NOISE AMPLIFIER

  • Supply Current-Max:

    100 mA

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • VSWR-Max:

    1.58

CMD245C4 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used to connect the device to the antenna.
  • The optimal bias point for maximum power efficiency is typically around 3.5V to 4.5V. The bias voltage should be adjusted to achieve the desired output power while minimizing current consumption. A bias tee or a separate bias voltage supply can be used to optimize the biasing.
  • A pi-network or a T-network can be used for input and output matching. The network should be designed to match the device's input and output impedance to 50 ohms. The values of the matching components can be determined using simulation software or by iterative measurement and optimization.
  • A heat sink or a thermal pad should be used to dissipate heat from the device. The device should be mounted on a metal core PCB or a thermal management substrate. The operating temperature should be kept below 85°C to prevent thermal shutdown.
  • A diode-based ESD protection circuit or a TVS (Transient Voltage Suppressor) can be used to protect the device from electrostatic discharge. The ESD protection circuit should be designed to clamp the voltage to a safe level during an ESD event.

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CMD245C4 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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