The recommended land pattern for CMP0603-FX-1004ELF is a rectangular pad with a size of 0.65 mm x 0.65 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the CMP0603-FX-1004ELF is rated for operation up to 125°C, it's essential to consider the specific application and environment. If the device will be exposed to high temperatures for extended periods, it's recommended to consult with Bourns Inc or perform thorough thermal testing to ensure reliability.
To prevent damage during PCB assembly, handle the CMP0603-FX-1004ELF by the edges, avoid touching the component's surface, and use anti-static wrist straps or mats. Additionally, ensure the PCB is properly cleaned and dried before assembly to prevent moisture-related issues.
The recommended soldering profile for CMP0603-FX-1004ELF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the recommended soldering profile to ensure proper solder joint formation and prevent damage to the component.
While the CMP0603-FX-1004ELF is designed to operate in a variety of environments, it's not recommended for use in applications with high humidity or moisture. If the device will be exposed to humid or moist environments, consider using a conformal coating or potting compound to protect the component.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CMP0603-FX-1004ELF Overview
Use the download button to access the CMP0603-FX-1004ELF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMP06,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
