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CMP2010-FX-1003ELF - Bourns

Description: Thick Film Resistors - SMD ResHighPower 2010 100k 1% 1W TC100

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CMP2010-FX-1003ELF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CHV2010
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CMP2010-FX-1003ELF - Bourns  - 3D model - Resistor Chip - CHV2010
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CMP2010-FX-1003ELF Details

  • Manufacturer Part Number:

    CMP2010-FX-1003ELF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    10

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    5 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

CMP2010-FX-1003ELF Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance and minimize parasitic effects.
  • The CMP2010-FX-1003ELF has a maximum operating temperature of 125°C. Ensure that your design takes into account thermal management, such as providing adequate heat dissipation paths and avoiding thermal hotspots. You may also need to consider thermal interface materials and heat sinks depending on your application.
  • Bourns recommends following the IPC J-STD-020D standard for soldering and assembly. A typical reflow soldering temperature profile should have a peak temperature of 260°C, with a dwell time of 20-30 seconds above 250°C. Ensure that your assembly process meets these requirements to prevent damage to the component.
  • The CMP2010-FX-1003ELF is designed to operate in harsh environments, but it's still essential to follow proper design and assembly practices to ensure reliability and longevity. Consider factors such as moisture protection, vibration resistance, and electromagnetic interference (EMI) shielding in your design.
  • The CMP2010-FX-1003ELF has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. The component is also designed to prevent latch-up conditions, but ensure that your design takes into account proper power sequencing and voltage ramp-up times.

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CMP2010-FX-1003ELF Overview

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