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CMPA0530002S - MACOM

Description: RF Amplifier GaN HEMT, MMIC, 2W, 0.5-3.0GHz, 28V, 3x4

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PCB Footprints
CMPA0530002S - MACOM PCB footprint - Small Outline No-lead - Small Outline No-lead - 12-DFN
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3D Models
CMPA0530002S - MACOM  - 3D model - Small Outline No-lead - 12-DFN
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CMPA0530002S Details

  • Manufacturer Part Number:

    CMPA0530002S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    MACOM

  • YTEOL:

    7

CMPA0530002S Frequently Asked Questions (FAQs)

  • MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
  • MACOM provides a recommended matching network topology in the application note. Optimize the component values using simulation tools like Genesys or ADS, and consider using a tunable matching network for optimal performance.
  • The maximum safe operating temperature for the CMPA0530002S is 150°C. However, it's recommended to operate the device at a temperature below 120°C for optimal reliability and performance.
  • Ensure the input and output impedances are well-matched, and the circuit is properly biased. Add resistive feedback or a stability network if necessary. Also, consider using a shielded enclosure and proper grounding to minimize electromagnetic interference.
  • MACOM recommends a voltage-controlled biasing scheme. Set the quiescent current by adjusting the voltage on the VGG pin, typically between 2.5V to 4.5V, depending on the desired operating point.

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