CPC1560GS footprint, schematic symbol and 3D model by LITTELFUSE

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CPC1560GS Details

The recommended PCB footprint for CPC1560GS is a 1206 package with a pad size of 1.5mm x 0.75mm and a spacing of 0.5mm between pads.
To ensure reliable soldering of CPC1560GS, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid overheating the component or the PCB.
The maximum surge current rating for CPC1560GS is 100A for 8/20μs waveform, and 50A for 10/1000μs waveform.
Yes, CPC1560GS can be used in high-temperature applications up to 150°C, but the component's performance and reliability may degrade at temperatures above 125°C.
To select the correct fuse rating, consider the maximum current and voltage ratings of your application, as well as the desired response time and fault-clearing characteristics. Consult the datasheet and application notes for guidance.

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