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CPDH5V0P-HF - Comchip Technology

Description: ESD Suppressors / TVS Diodes ESD 5V BI-DIRECTION HALOGEN-FREE

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PCB Footprints
CPDH5V0P-HF - Comchip Technology PCB footprint - Other - Other - CPDH5V0P-HF-2
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3D Models
CPDH5V0P-HF - Comchip Technology  - 3D model - Other - CPDH5V0P-HF-2
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CPDH5V0P-HF Details

  • Manufacturer Part Number:

    CPDH5V0P-HF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    5.98

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    8 V

  • Breakdown Voltage-Min:

    5.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Peak Rev Power Dis-Max:

    39 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

CPDH5V0P-HF Frequently Asked Questions (FAQs)

  • A good PCB layout for CPDH5V0P-HF involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • To prevent ESD damage, handle CPDH5V0P-HF in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and use ESD-safe packaging and storage materials. Avoid touching the device's pins or leads, and use an anti-static bag or wrap when storing the device.
  • Yes, CPDH5V0P-HF is designed to withstand vibrations up to 10G. However, it's essential to ensure the device is properly mounted and secured to the PCB to prevent mechanical stress. Consider using a vibration-dampening material or a shock-absorbing mount to minimize the impact of vibrations.
  • To troubleshoot issues with CPDH5V0P-HF, start by checking the power supply voltage, input/output connections, and PCB layout. Use an oscilloscope to verify the input and output waveforms, and check for any signs of overheating or physical damage. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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CPDH5V0P-HF Overview

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