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CPDU5V0USP-HF - Comchip Technology

Description: ESD Suppressors / TVS Diodes 5V UNI-DIRECTION LOW CAPACITANCE

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PCB Footprints
CPDU5V0USP-HF - Comchip Technology PCB footprint - Diodes Moulded - Diodes Moulded - 0603/SOD-523F11
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CPDU5V0USP-HF - Comchip Technology  - 3D model - Diodes Moulded - 0603/SOD-523F11
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CPDU5V0USP-HF Details

  • Manufacturer Part Number:

    CPDU5V0USP-HF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-523F, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    5.4 V

  • Clamping Voltage-Max:

    25 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e4

  • Non-rep Peak Rev Power Dis-Max:

    75 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CPDU5V0USP-HF Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the CPDU5V0USP-HF near the power input, using a solid ground plane, and minimizing trace lengths. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad layout.
  • To ensure EMC and reduce EMI, use a metal shield around the CPDU5V0USP-HF, keep sensitive components away, and follow proper PCB layout and grounding techniques. Additionally, use EMI filters and shielding on cables and connectors.
  • The CPDU5V0USP-HF has a high reliability rating, with an MTBF of >100,000 hours at 40°C ambient temperature. However, actual reliability may vary depending on operating conditions, PCB quality, and manufacturing processes.
  • Comchip recommends performing thorough testing, including input voltage, output voltage, and efficiency tests, as well as environmental stress tests (e.g., temperature, humidity) to ensure the CPDU5V0USP-HF meets the required specifications.
  • Store the CPDU5V0USP-HF in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical components. Use anti-static wrist straps and mats when handling the device.

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CPDU5V0USP-HF Overview

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