CR0201-FW-2201GLF - Bourns

CR0201-FW-2201GLF Frequently Asked Questions (FAQs)

• What is the recommended land pattern for CR0201-FW-2201GLF?
  The recommended land pattern for CR0201-FW-2201GLF is a rectangular pad with a size of 0.5 mm x 0.25 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use CR0201-FW-2201GLF in a high-temperature application?
  While CR0201-FW-2201GLF is rated for operation up to 150°C, it's not recommended for high-temperature applications above 125°C. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
• How do I handle the CR0201-FW-2201GLF during PCB assembly?
  Handle CR0201-FW-2201GLF components by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage.
• What is the moisture sensitivity level (MSL) of CR0201-FW-2201GLF?
  The MSL of CR0201-FW-2201GLF is MSL 1, which means it can withstand normal humidity and temperature conditions without special handling or storage requirements.
• Can I use CR0201-FW-2201GLF in a high-vibration or high-shock application?
  While CR0201-FW-2201GLF is designed to withstand normal vibration and shock, it's not recommended for extreme vibration or shock applications. Consult Bourns Inc or a qualified engineer for specific guidance on using this component in such environments.