The recommended land pattern for CR0201-FW-4871GLF is a rectangular pad with a size of 0.5 mm x 0.25 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0201-FW-4871GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and the component's power rating. For high-temperature applications, it's recommended to consult with Bourns' application engineers to ensure the component's reliability and performance.
To minimize the risk of moisture-related issues, it's crucial to follow proper storage and handling procedures. Store the components in a dry, cool place, and avoid exposing them to high humidity or moisture. If the components are exposed to moisture, follow Bourns' recommended baking procedure to remove excess moisture before assembly.
The recommended soldering profile for CR0201-FW-4871GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering process to prevent thermal shock and ensure reliable solder joints.
While CR0201-FW-4871GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends consulting with their application engineers to determine the component's suitability for high-vibration or shock applications and to discuss potential customization options.
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CR0201-FW-4871GLF Overview
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