The recommended land pattern for CR0402-F/-3R30GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The CR0402-F/-3R30GLF is rated for operation up to 150°C, but it's not recommended for use in high-temperature applications above 125°C without derating. Consult the datasheet for derating information and consider using a high-temperature-rated component if necessary.
Handle the CR0402-F/-3R30GLF by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
The recommended soldering profile for CR0402-F/-3R30GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. Consult the datasheet for more detailed information.
The CR0402-F/-3R30GLF is not hermetically sealed and is not designed for use in humid or wet environments. If exposure to moisture is unavoidable, consider using a conformal coating or potting compound to protect the component. Consult the datasheet for more information on environmental ratings.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CR0402-F/-3R30GLF Overview
Use the download button to access the CR0402-F/-3R30GLF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CR040,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
