The recommended land pattern for CR0402-FX-1371GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-1371GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and the component's power rating. If the application exceeds the component's power rating, it may not operate reliably or safely at high temperatures.
CR0402-FX-1371GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to the manufacturer's recommendations before reflow soldering.
The recommended soldering profile for CR0402-FX-1371GLF is a reflow profile with a peak temperature of 260°C, a dwell time above 217°C of 20-30 seconds, and a ramp rate of 3°C/second. This ensures proper soldering and minimizes the risk of component damage.
While CR0402-FX-1371GLF is a robust component, it's essential to consider the specific application's vibration and shock requirements. If the application exceeds the component's mechanical stress limits, it may not operate reliably or safely. Consult with Bourns Inc or a qualified engineer to determine the component's suitability for your specific application.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CR0402-FX-1371GLF Overview
Use the download button to access the CR0402-FX-1371GLF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CR040,
or try a keyword search, such as Ruthenium Oxide Resistors
