The recommended land pattern for CR0402-FX-1372GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-1372GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and the component's power rating. For high-temperature applications, it's recommended to consult with Bourns' application engineers to ensure the component's reliability and performance.
CR0402-FX-1372GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to Bourns' recommended procedures before reflow soldering.
Bourns recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. However, it's essential to consult the specific reflow soldering profile recommended by Bourns for this component and to ensure that the profile is compatible with other components on the PCB.
While CR0402-FX-1372GLF is designed to be reliable in various environments, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends consulting their application engineers to determine the component's suitability for high-vibration or high-shock applications and to discuss potential customization options.
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