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CR0402-FX-1653GLF - Bourns

Description: Thick Film Resistors - SMD 165KOHM 1/16WATT 1%

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CR0402-FX-1653GLF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CR0402
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CR0402-FX-1653GLF Details

  • Manufacturer Part Number:

    CR0402-FX-1653GLF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.32 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Resistance:

    165000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

CR0402-FX-1653GLF Frequently Asked Questions (FAQs)

  • The recommended land pattern for CR0402-FX-1653GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While CR0402-FX-1653GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends derating the component's power rating at higher temperatures to ensure reliability and prevent thermal runaway.
  • CR0402-FX-1653GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in their original packaging or in a dry, nitrogen-filled environment. Follow the recommended baking and handling procedures outlined in the IPC/JEDEC J-STD-033 standard to minimize the risk of moisture-related failures.
  • Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • While CR0402-FX-1653GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends evaluating the component's performance under simulated environmental conditions to ensure its suitability for the intended application.

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CR0402-FX-1653GLF Overview

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Part Image RC0402F1653 Synton-Tech Corp

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For a full list of alternate parts for CR0402-FX-1653GLF, check out Findchips.com