The recommended land pattern for CR0402-FX-2373GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-2373GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, high-temperature applications may require special soldering processes and materials.
CR0402-FX-2373GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to the manufacturer's recommendations before reflow soldering.
The recommended soldering profile for CR0402-FX-2373GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the manufacturer's recommended soldering profile to ensure reliable solder joints and prevent component damage.
While CR0402-FX-2373GLF is designed to be robust, it's essential to consider the component's mechanical stress limits and ensure that it is properly secured to the PCB. Additional mechanical support or potting may be necessary in high-vibration or high-shock applications.
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CR0402-FX-2373GLF Overview
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