The recommended land pattern for CR0402-FX-2940GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-2940GLF is rated for operation up to 150°C, it's essential to consider the specific application and environment. If your design requires exposure to high temperatures, consult with Bourns' application engineers to determine the suitability of this component.
To prevent damage, handle CR0402-FX-2940GLF by the edges, avoiding touching the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Follow standard SMT assembly procedures and guidelines.
The recommended soldering profile for CR0402-FX-2940GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure the soldering process is within the specified temperature range to prevent damage or degradation.
While CR0402-FX-2940GLF is designed to operate in a variety of environments, it's essential to consider the specific application and humidity levels. If your design requires exposure to high humidity, consult with Bourns' application engineers to determine the suitability of this component and potential additional protection measures.
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CR0402-FX-2940GLF Overview
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