The recommended land pattern for CR0402-FX-3401GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-3401GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
Handle CR0402-FX-3401GLF by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force during assembly.
The recommended soldering profile for CR0402-FX-3401GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the component's specified temperature range and follows the manufacturer's guidelines.
While CR0402-FX-3401GLF is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) and ensure that it is properly sealed or coated to prevent moisture ingress. Follow the manufacturer's guidelines for humidity and moisture exposure.
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CR0402-FX-3401GLF Overview
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