The recommended land pattern for CR0402-FX-3570GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-3570GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, high-temperature soldering profiles should be used during assembly.
CR0402-FX-3570GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and using a moisture barrier bag or desiccant packet.
Bourns recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. Hand soldering is not recommended due to the risk of overheating the component.
While CR0402-FX-3570GLF is designed to be robust, it's essential to consider the component's mechanical stress limits. In high-vibration or shock applications, ensure that the component is properly secured to the PCB, and consider using additional mechanical support or potting compounds to prevent damage.
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CR0402-FX-3570GLF Overview
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