The recommended land pattern for the CR0402-FX-3651GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
The CR0402-FX-3651GLF is rated for operation up to 150°C, but it's recommended to derate the component's power rating when operating at high temperatures. Consult the datasheet and Bourns' application notes for specific guidance on high-temperature operation.
Handle the CR0402-FX-3651GLF by the edges to prevent damage to the component's termination. Avoid touching the component's pads or body to prevent electrostatic discharge (ESD) damage. Use ESD-safe handling and storage procedures to ensure the component's reliability.
The CR0402-FX-3651GLF is designed to meet the requirements of various industry standards for vibration and shock. However, it's recommended to consult Bourns' application notes and perform thorough testing to ensure the component's reliability in specific high-vibration or high-shock applications.
The recommended soldering profile for the CR0402-FX-3651GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Consult the datasheet and Bourns' application notes for specific guidance on soldering profiles and techniques.
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CR0402-FX-3651GLF Overview
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