The recommended land pattern for CR0402-FX-3653GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-3653GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
CR0402-FX-3653GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering if they have been exposed to moisture.
The recommended soldering profile for CR0402-FX-3653GLF is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. This ensures proper soldering and minimizes the risk of component damage.
While CR0402-FX-3653GLF is a robust component, it's essential to consider the mechanical stress and vibration requirements of your application. Bourns provides guidance on component mounting and PCB design to ensure reliability in harsh environments. Consult with Bourns' application engineers or refer to their documentation for more information.
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CR0402-FX-3653GLF Overview
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