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CR0402-FX-5231GLF - Bourns

Description: Thick Film Resistors - SMD CHIP RESISTOR

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CR0402-FX-5231GLF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CR0402
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CR0402-FX-5231GLF Details

  • Manufacturer Part Number:

    CR0402-FX-5231GLF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.32 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Resistance:

    5230 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

CR0402-FX-5231GLF Frequently Asked Questions (FAQs)

  • The recommended land pattern for CR0402-FX-5231GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While CR0402-FX-5231GLF is rated for operation up to 150°C, it's essential to consider the specific application and environmental conditions. If your design requires exposure to high temperatures, consult with Bourns' application engineers to determine the suitability of this component.
  • To prevent damage during assembly, handle CR0402-FX-5231GLF by the edges, avoiding touching the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Additionally, follow standard SMT assembly procedures to ensure proper placement and soldering.
  • The typical lead time for CR0402-FX-5231GLF can vary depending on the region, distributor, and quantity. However, as a general guideline, expect a lead time of 4-6 weeks for standard quantities. For large quantities or custom orders, consult with Bourns' sales representatives or authorized distributors for more accurate lead times.
  • Yes, CR0402-FX-5231GLF should be stored in a dry, cool environment (20°C to 30°C, 60% to 70% relative humidity) away from direct sunlight. Avoid exposing the components to moisture, extreme temperatures, or physical stress. Follow standard component storage and handling procedures to maintain the component's integrity.

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CR0402-FX-5231GLF Overview

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Part Image TFA0402R5231F-T10 Thin Film Technology Corp (TFT)

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Part Image RAT025231FTH Ralec

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Part Image ADF04025K231%100PPM/KNP10 Microtech GmbH Electronic

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For a full list of alternate parts for CR0402-FX-5231GLF, check out Findchips.com