The recommended land pattern for CR0402-FX-5493GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-5493GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, high-temperature soldering processes may affect the component's reliability.
CR0402-FX-5493GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures before reflow soldering.
The recommended soldering profile for CR0402-FX-5493GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the component's specified thermal limits.
While CR0402-FX-5493GLF is designed to be reliable, it's essential to consider the component's mechanical stress limits. Ensure that the component is properly secured to the PCB and that the application's vibration and shock requirements are within the component's specified limits.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CR0402-FX-5493GLF Overview
Use the download button to access the CR0402-FX-5493GLF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CR040,
or try a keyword search
