The recommended land pattern for CR0402-FX-8063GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the CR0402-FX-8063GLF is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
To prevent damage, handle the CR0402-FX-8063GLF by the edges, avoid touching the component's surface, and use anti-static wrist straps or mats. During PCB assembly, ensure that the component is properly aligned and seated on the PCB to prevent mechanical stress.
The recommended soldering profile for CR0402-FX-8063GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of component damage.
While the CR0402-FX-8063GLF is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) rating of 3. This means that the component can withstand some humidity, but it's crucial to follow proper handling and storage procedures to prevent moisture-related damage.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CR0402-FX-8063GLF Overview
Use the download button to access the CR0402-FX-8063GLF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CR040,
or try a keyword search, such as Ruthenium Oxide Resistors
