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CR0402-FX-9100GLF - Bourns

Description: Thick Film Resistors - SMD 910 OHM 1%

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CR0402-FX-9100GLF - Bourns - PCB symbol
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CR0402-FX-9100GLF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CR0402
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CR0402-FX-9100GLF - Bourns - 3D model - Resistor Chip - CR0402
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CR0402-FX-9100GLF Details

  • Manufacturer Part Number:

    CR0402-FX-9100GLF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.32 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Resistance:

    910 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

CR0402-FX-9100GLF Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CR0402-FX-9100GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • The CR0402-FX-9100GLF is rated for operation up to 150°C, but it's recommended to derate the component's power rating by 50% when operating above 125°C. Additionally, ensure that the component is properly soldered and the PCB is designed to handle high temperatures.
  • The CR0402-FX-9100GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures before soldering. Use a nitrogen-filled packaging or a desiccant pack to maintain a dry environment during storage.
  • The recommended soldering profile for the CR0402-FX-9100GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • The CR0402-FX-9100GLF is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, consider using additional mechanical support or a more robust component. Consult with Bourns Inc or a qualified engineer for specific guidance.

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CR0402-FX-9100GLF Overview

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