The recommended land pattern for CR0402-FX-9760GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the CR0402-FX-9760GLF is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
To minimize the risk of moisture-related issues, it's recommended to store the CR0402-FX-9760GLF in a dry environment (less than 30% relative humidity) and use a moisture barrier bag or desiccant packaging. During assembly, ensure that the PCB is dry and free of moisture before applying the component.
The recommended soldering profile for CR0402-FX-9760GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the soldering profile recommended by Bourns Inc to ensure reliable solder joints and prevent damage to the component.
While the CR0402-FX-9760GLF is designed to be robust, it's essential to consider the component's mechanical stress limits and ensure that the PCB is designed to withstand the expected vibration or shock levels. Additional mechanical support or potting may be necessary to ensure the component's reliability in such applications.
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CR0402-FX-9760GLF Overview
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