The recommended land pattern for CR0402-JW-751GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.1 mm from the component body.
CR0402-JW-751GLF is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet and Bourns' application notes for more information on high-temperature operation.
Yes, CR0402-JW-751GLF is compatible with lead-free soldering processes and meets the requirements of the RoHS directive. The component is designed to withstand the higher temperatures associated with lead-free soldering.
CR0402-JW-751GLF has a moisture sensitivity level (MSL) of 1, which means it can be exposed to a maximum of 30°C/60% RH for 168 hours before soldering.
CR0402-JW-751GLF is designed to meet the requirements of IEC 60068-2-27 for vibration and IEC 60068-2-29 for shock. However, it's recommended to consult Bourns' application notes and perform additional testing to ensure the component meets the specific requirements of your application.
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CR0402-JW-751GLF Overview
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