The recommended land pattern for CR0402AFX-2001GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While CR0402AFX-2001GLF has a rated operating temperature range of -55°C to 125°C, it's not recommended for high-temperature applications above 105°C. The component's reliability and performance may degrade above this temperature.
CR0402AFX-2001GLF is a moisture-sensitive device (MSD). To prevent damage, it's essential to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering.
The recommended soldering profile for CR0402AFX-2001GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper soldering and minimizes the risk of component damage.
While CR0402AFX-2001GLF is designed to be robust, it's not specifically designed for high-vibration or high-shock applications. If your application requires high reliability in such environments, it's recommended to consult with Bourns Inc or perform additional testing to ensure the component's suitability.
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CR0402AFX-2001GLF Overview
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