The recommended land pattern for CR0603-FX-5490ELF is a rectangular pad with a size of 0.75 mm x 0.75 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0603-FX-5490ELF is rated for operation up to 150°C, it's essential to consider the specific application and environmental conditions. For high-temperature applications above 125°C, it's recommended to consult with Bourns' application engineers to ensure the component's reliability and performance.
CR0603-FX-5490ELF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to Bourns' recommended procedures before reflow soldering.
Bourns recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. However, the specific profile may vary depending on the board design and manufacturing process. It's recommended to consult with Bourns' application engineers for customized guidance.
While CR0603-FX-5490ELF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends consulting with their application engineers to determine the component's suitability for high-vibration or high-shock applications and to discuss potential customization options.
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