The recommended land pattern for CR0603-FX-8662ELF is a rectangular pad with a size of 0.75 mm x 0.75 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While CR0603-FX-8662ELF is rated for operation up to 125°C, it's not recommended for use in high-temperature applications above 105°C without proper derating. Consult with Bourns' application engineers for specific guidance on high-temperature use.
To ensure the chip resistor can handle high currents, calculate the power dissipation using the formula P = I^2 x R, where P is the power, I is the current, and R is the resistance. Ensure the calculated power is within the resistor's power rating (0.1 W for CR0603-FX-8662ELF). If necessary, consider using a higher-power resistor or a different component.
The MSL of CR0603-FX-8662ELF is MSL 1, which means it can withstand normal humidity and temperature conditions without special handling or storage requirements.
While CR0603-FX-8662ELF is a robust component, it's not specifically designed for high-vibration or high-shock applications. If your application requires such conditions, consider using a more ruggedized component or consult with Bourns' application engineers for guidance on component selection.
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CR0603-FX-8662ELF Overview
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