The recommended land pattern for the CR0805-FX-1183ELF is a rectangular pad with a size of 0.8mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
Yes, the CR0805-FX-1183ELF is compatible with lead-free soldering processes, including RoHS and WEEE compliant processes. The component is made with a tin-silver-copper (SnAgCu) alloy that is compatible with lead-free soldering.
The maximum operating temperature range for the CR0805-FX-1183ELF is -40°C to +125°C. However, the component's performance and reliability may degrade at temperatures above 85°C, so it's recommended to operate the component within the -20°C to +70°C range for optimal performance.
The CR0805-FX-1183ELF is designed to meet the requirements of IEC 60068-2-27 for vibration and IEC 60068-2-29 for shock. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of the application.
The CR0805-FX-1183ELF is a commercial-grade component, but it can be used in high-reliability or safety-critical applications with proper design, testing, and validation. However, it's recommended to consult with Bourns Inc or a qualified reliability engineer to ensure the component meets the specific requirements of the application.
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CR0805-FX-1183ELF Overview
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