The recommended land pattern for the CR0805-FX-2373ELF is a rectangular pad with a size of 0.8mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
The CR0805-FX-2373ELF is rated for operation up to 150°C, but it's recommended to derate the component's power rating by 1.5% per degree Celsius above 125°C. It's also important to ensure that the component is properly soldered and mounted to prevent thermal stress.
The CR0805-FX-2373ELF is a sensitive component and requires careful handling during PCB assembly and rework. It's recommended to use a vacuum pickup tool or a gentle tweezers to handle the component, and to avoid touching the component's leads or body to prevent damage or contamination.
The CR0805-FX-2373ELF has a moisture sensitivity level (MSL) of 3, which means it can be exposed to a maximum of 168 hours at 30°C and 60% relative humidity before soldering. It's recommended to follow the recommended storage and handling procedures to prevent moisture absorption.
The CR0805-FX-2373ELF is designed to meet the requirements of IEC 60068-2-27 for vibration and IEC 60068-2-29 for shock. However, it's recommended to perform additional testing and validation to ensure the component's performance and reliability in specific high-vibration or high-shock applications.
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CR0805-FX-2373ELF Overview
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