The recommended land pattern for CR0805-FX-5621ELF is a rectangular pad with a size of 0.8mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
Yes, CR0805-FX-5621ELF is compatible with lead-free soldering. Bourns Inc. recommends using a soldering temperature profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds.
The maximum operating temperature range for CR0805-FX-5621ELF is -40°C to 125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
Yes, CR0805-FX-5621ELF is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
Yes, CR0805-FX-5621ELF is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, meeting the requirements for lead-free and hazardous substance-free components.
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CR0805-FX-5621ELF Overview
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