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CR1206AFX-2003EAS - Bourns

Description: BOURNS - CR1206AFX-2003EAS - SMD Chip Resistor, 1206 [3216 Metric], 200 kohm, CR1206A-AS Series, 200 V, Thick Film, 250 mW

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CR1206AFX-2003EAS - Bourns - PCB symbol
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PCB Footprints
CR1206AFX-2003EAS - Bourns PCB footprint - Resistor Chip - Resistor Chip - CR1206_1
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CR1206AFX-2003EAS - Bourns - 3D model - Resistor Chip - CR1206_1
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CR1206AFX-2003EAS Details

  • Manufacturer Part Number:

    CR1206AFX-2003EAS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    12

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    200000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

CR1206AFX-2003EAS Frequently Asked Questions (FAQs)

  • The recommended land pattern for CR1206AFX-2003EAS is a rectangular pad with a size of 1.3 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While CR1206AFX-2003EAS is rated for operation up to 125°C, it's not recommended for use in high-temperature applications above 105°C without derating. Consult the datasheet for derating guidelines and consider using a high-temperature-rated alternative if necessary.
  • CR1206AFX-2003EAS is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component's pins or body, and ensure that your assembly process follows ESD-safe practices.
  • The recommended soldering profile for CR1206AFX-2003EAS is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that your soldering process follows this profile to prevent damage to the component.
  • CR1206AFX-2003EAS is not designed for use in humid or wet environments. It's recommended to use a conformal coating or potting compound to protect the component from moisture if it will be exposed to such conditions.

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CR1206AFX-2003EAS Overview

Use the download button to access the CR1206AFX-2003EAS schematic symbol, PCB footprint, and 3D model.
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